features * plastic package has underwriters laboratory flammability classification 94v-0 * high temperature metallurgically bonded construction * cavity-free glass passivated junction * capable of meeting environmental standards of mil-s-19500 * 3.0 a operation at ta=75 c with no thermal runaway * typical ir less than 1.0 a * high temperature soldering guaranteed: 260 c/10 seconds mechanical data case : jedec do-214ab/SMC, molded plastic over glass diewe declare that the material of product compliance terminals : plated axial leads, solderable perwith rohs requirements mil-std-750, method 2026 polarity : color band denotes cathode end mounting position : any weight : 0.21g handling precautin :none electrical characteristic 1.maximum & thermal characteristics ratings at 25 c ambient temperature unless otherwise specified. parameter symbol symbol s3as3bs3ds3gs3js3ks3m unit device marking code s3as3bs3ds3gs3js3ks3m maximum repetitive peak reverse voltage v rrm 50100200400600 8001000v maximum rsm voltage v rsm 3570140280420560700 v maximum dc blocking voltage v dc 501002004006008001000 v maximum average forward rectified current 0.375" (9.5mm) lead length at t a = 75 c if(av) a peak forward surge current 8.3ms single half sine- wave superimposed on rated load (jedec method) i fsm a typical thermal resistance (note 1) r ja c/w operating junction and storage temperature range tj, tstg c electrical characteristics ratings at 25 c ambient temperature unless otherwise specified. parameter symbol symbol s3as3bs3ds3gs3js3ks3m unit maximum instantaneous forward voltage at 3.0a v f v maximum dc reverse current ta = 25 c at rated dc blocking voltage ta = 125 c ir a typical junction capacitance at 4.0v, 1mhz cjpf notes: 1. mounted on copper leaf area of 1.57in2(40mm 2 ). C 50 to +150 55 1.1 5.0 100 30.0 3.0 200 s3a thru s3m surface mount glass passivated junction rectifiers reverse voltage 50 to 1000v forward current 3.0a
2.ratings and characteristic curves ( ta = 25 c unless otherwise noted ) s3a thru s3m fig. 1 C forward current derating curve fig. 2 C maximum non-repetitive peak forward surge current fig 4. C typical reverse characteristics fig 3. C typical instantaneous forward characteristics fig 5. C typical transient thermal impedance fig 6. C typical junction capacitance a v e r a g e f o r w a r d r e c t i f i e d c u r r e n t ( a ) a v e r a g e f o r w a r d r e c t i f i e d c u r r e n t ( a ) i n s t a n t a n e o u s f o r w a r d c u r r e n t ( a ) i n s t a n t a n e o u s r e v e r s e c u r r e n t ( a ) j u n c t i o n c a p a c i t a n c e ( p f ) 0 25 50 75 100 125 150 175 1 10 100 0.6 0.8 1.0 1.2 1.4 1.60 20 40 60 80 100 0.1 1 10 100 20 10 1.0 100 10 1.0 0.1 0.01 10 1.0 0.1 0.01 100 3.0 1.5 0 50 200 150 100 50 0 60 hz resistive or inductive load 0.375" (9.5mm) lead length tj = tj max 8.3ms single half sine-wave (jedec method) tj = 25 c pulse width = 300 s 1% duty cycle tj = 25 c f = 1.0 mhz vsig = 50mvp-p ambient temperature, c number of cycles at 60hz instantaneous forward voltage (v)percent of rated peak reverse voltage (%) reverse voltage (v) tj=125 tj=25 t r a n s i e n t t h e r m a l i m p e d a n c e ( c / w ) 10 1.0 0.1 100 0.01 0.1 1.0 10 100 t,pulse duration,sec
3. dimension: s3a thru s3m
titile: 1.1 ? reel a. ? reel spec mm abcw 177.0 2.054.0 0.513.0 0.513.2 0.2 330.0 2.075.0 0.513.0 0.513.2 0.2 330.0 2.075.0 0.513.0 0.513.5 0.5 330.0 2.075.0 0.513.0 0.517.0 0.5 b. 13" ? inner box mm abc ? 335 5.0335 2.040 1.0 ?? ? ?? quantity ? 10k 6k 6k smb13" SMC13" ? 2k 5k 3k 3k sma13" sma 7" sma13" SMC13" smb13" ?? wi-258 ? smd ??Z 3 0 ? 2 ? smd ??e????? packaging specification of smd general packaging materials spec. and quantity
titile: c. 7" ? box mm abc ? 188 2.0188 2.0138 2.0 ?? ? ?? quantity 7" d. reel carton mm abc ? 350 2.0340 2.0350 2.0 ?? ? ?? ? 80k 80k 48k 36k 1.2 tape spec a. cover tape mm a sma smb SMC13.30 0.10 smb13" SMC13" 9.30 0.10 0.068 0.005 b packaging specification of smd 3 ? 16k ? sma 7" sma13" ?? wi-258 ? smd ??Z ?? wi-258
titile: b. sma smb SMC w12 0.3 12 0.3 16 0.3 p14 0.1 8 0.1 8 0.1 e1.75 0.1 1.75 0.1 1.75 0.1 f5.5 .05 5.5 0.05 7.5 .05 d01.55 0.05 1.55 0.05 1.55 0.05 d11.5 0.1 1.55 0.05 1.55 0.05 p04 0.1 4 0.1 4 0.1 p22 0.05 2 0.05 2 0.05 10p040 0.2 40 0.2 40 0.2 a02.79 0.1 3.8 0.1 6.05 0.1 b05.33 0.1 5.4 0.1 8.31 0.1 k02.36 0.1 2.45 0.1 2.54 0.1 t0.25 0.05 0.25 0.05 0.25 0.05 2 smd ??e?Z general spec of smd 5.2.1 ?? domestic a. 7" reel ??? all the label on cathode side a : lrc ? ; b : rohs ? c : ? hf label b. 13" ??? all the label on cathode side ? hf only a : lrc ? ; b : rohs ? c : ? ? hf only 4 ? ? smd ??Z 3 0 ? ?? wi-258 packaging specification of smd a a a k o sec.:a-a' ao p2 p1 a do w e f a' b po b' b o sec.:b-b' t d1 c c c c ? ( ??
titile: c. ? ? label spec lrc ? label rohs ? ? hf label ??? all the label on cathode side overseas 13" ? inner box a : lrc ? ; b : rohs ? c : ? hf label ? hf only 5 ? 7" ? inner box packaging specification of smd ?? wi-258 ? smd ??Z 3 0 ? 2.2 ? a a ****** ****** ****** ****** lrc ? type ? quantity ? date ? lot green c c c
titile: lrc ? label rohs ? ? hf label ? note: 1. 13" ?? ? , ? ? ;13"reel inner box must be packed by shrink film 2. ?? ? , ? ? ; every tape after packing must be fixed by white adhesive tape 3.1 ? l testing report of the oqc ?? ? l every lot must with test report 3.2 ? ? ? ?? ? ? ? ?? ? ? the same coding is only one ending for each batch box materials for the mantissa to be good filled with cushioning material. mark:****** q'ty:****** ?? wi-258 ? smd ??Z 3 0 ? 6 ? date:****** type:****** packaging specification of smd lrc ? ? ? ? green
4. update record 1 2 ??Z? 2011-9-15 ??? ?? 2011-3-4 s3a thru s3m
|
